Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Autor
John H. Lau
Editura
Springer Verlag, Singapore
An publicare
2018
Nr. Pagini
303
ISBN
9789811088834
Categorii
Biografii Memorii Jurnale In Limbi Străine
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Descriere

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

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