Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Autor

Xing Chang Wei

Editura

Taylor & Francis Ltd

An publicare

2017

Nr. Pagini

322

ISBN

9781138033566

Categorii

In Limbi Străine

SHARE

Descriere

Comandă Cartea

998^Lei

carturesti.ro

--^Lei

libhumanitas.ro

--^Lei

cartepedia.ro

--^Lei

librariadelfin.ro

--^Lei

books-express.ro

--^Lei

libris.ro

--^Lei

librex.ro

--^Lei

curteaveche.ro

--^Lei

litera.ro

Pe aceeași temă

Using Ansys for Finite Element Analysis, Volume II: Dynamic, Probabilistic Design and Heat Transfer Analysis, Paperback/Wael A. Altabey

Wael A. Altabey

Electromagnetics and Antenna Technology

Alan J. Fenn

Modeling and Design of Flexible Pavements and Materials

David H. Allen

Mechanical Design of Electric Motors/Wei Tong

Wei Tong

Exam Ref 70-778 Analyzing and Visualizing Data by Using Microsoft Power BI

Daniil Maslyuk

Basic to Advanced Computer Aided Design Using Nx12: Modeling, Drafting, Assemblies & Sheetmetal, Paperback/Stephen M. Samuel P. E.

Stephen M. Samuel P. E.