Coperta cărții Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging de Xing Chang Wei

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Autor

Xing Chang Wei

Editura

Taylor & Francis Ltd

An publicare

2017

Nr. Pagini

322

ISBN

9781138033566

Categorii

In Limbi Străine

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Descriere

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